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heat sink compounds

heat sink compounds

Viscous fluid which increases the thermal conductivity of a thermal interface by filling microscopic air-gaps present due to the imperfectly flat and smooth surfaces of the components. In electronics, it is often used to aid a component's thermal dissipation via a heat sink.

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[profiler]
Memory usage: real: 30670848, emalloc: 29562504
Code ProfilerTimeCntEmallocRealMem